MG Chemicals 860-60G is a 60 g jar of white silicone heat transfer compound made with zinc oxide and polydimethylsiloxane. It moves heat from transistors, power diodes, semiconductors, ballasts and thermocouple wells into heat sinks or metal chassis. It will not dry out or harden and meets MIL-DTL-47113D.
Key Features
- Thermal conductivity 0.657 W/m·K (hot wire method)
- Dielectric strength 400 V/mil
- Will not dry or harden
- Use with heat sinks or metal chassis
- Max operating temperature 200 °C continuous, 300 °C intermittent
- Meets MIL-DTL-47113D
Specifications
| Brand / model | MG Chemicals 860-60G |
|---|---|
| Size | 60 g jar |
| Composition | Zinc oxide, polydimethylsiloxane |
| Appearance | White paste |
| Thermal conductivity | 0.657 W/m·K |
| Dielectric strength | 400 V/mil |
| Dielectric constant @ 1 kHz | 3.81 |
| Dissipation factor @ 1 kHz | 0.0032 |
| Specific gravity @ 25 °C | 2.3 min |
| Bleed / evaporation (24 h @ 200 °C) | 2.0% max each |
| Dropping point | > 260 °C (500 °F) |
| Max operating temperature | 200 °C continuous; 300 °C intermittent |
| Standard | MIL-DTL-47113D |
| SKU | 25860-60G |
What's Included
- MG Chemicals 860 silicone heat transfer compound, 60 g jar
Ideal For
Bench and production use on power transistors, diodes and other parts mounted to heat sinks.
Frequently Asked Questions
Is it electrically conductive?
The listing gives a dielectric strength of 400 V/mil and a very high volume resistivity, so it is an electrical insulator.
Will it dry out over time?
No, the listing says it will not dry or harden.