- Pad-Per-Hole both sides. Plated-thru holes.
- 0.080” diameter isolated solder pad around each hole on both sides.
- Unrestricted component placement and extended area for high density applications.
Specifications:
- Dimensions (H x W x Thick): 4.00" x 6.00" x 0.062" (101.6mm x 152.4mm x 1.57mm)
- Hole Diameter: 0.042" (1.067mm) Plated Thru
- Grid: 0.100" x 0.100" (2.54mm x 2.54mm)
- Circuit Pattern: Pad per hole - both sides
- Material: FR4
- UL Flammability Class: 94V-0
- 16 Pin DIP Capacity: 72
- Wire-Wrap Terminals: T44, T46, T49, T68
- Solder Terminals: T42-1, K24C, K31C
- Wire-Wrap Socket Pins: R32